Coil-embedded integrated circuit substrate and method of manufacturing the same
US9928952B2 · kind B2 · utility
0Cited by
2References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 19, 2015 |
| Grant date | Mar 27, 2018 |
| Priority date | — |
| Expiry date | Feb 5, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F2027/065
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A coil-embedded integrated circuit substrate includes a core substrate having an at least partially machined space formed herein, a coil disposed in the at least partially machined space, a filling material filling air gaps in a space around the coil in the at least partially machined space, and insulating layers formed on upper and lower surfaces of the core substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.