Patent · US Active

Device with interconnection structure for forming a conduction path or a conducting plane with high decoupling capacitance

US9929084B2 · kind B2 · utility

1Cited by
2References
14Claims
0Family size

Assignee

Inventor

Key dates

Filing dateFeb 9, 2017
Grant dateMar 27, 2018
Priority date
Expiry dateFeb 9, 2037

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L23/528
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Electronic device comprising an interconnection structure comprising an alternating stack of arrays of conducting lines and dielectric layers in which:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.