Patent · US Active

Resonant circuit including bump pads

US9929123B2 · kind B2 · utility

3Cited by
20References
21Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 8, 2015
Grant dateMar 27, 2018
Priority date—
Expiry dateJun 8, 2035

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH03B2200/0076
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Aspects of this disclosure relate to a first die includes an LC resonant circuit including a first capacitive element, such as a capacitor or a varactor, and an inductive element. The LC resonant circuit is configured to generate a signal having a frequency of oscillation. The first die includes bump pads electrically coupled to both ends of the first capacitive element. A second die can be flip chip mounted on the first die. Bumps can electrically connect a second capacitive element of the second die in parallel with the first capacitive element of the first die. This can increase the Q factor of the LC resonant circuit.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.