Electronic component and method of manufacturing the same
US9929231B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2016 |
| Grant date | Mar 27, 2018 |
| Priority date | — |
| Expiry date | Aug 30, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electronic component includes a body part and a via part. The body part includes first and second metal layers disposed with at least one dielectric layer interposed therebetween. The via part is disposed in the body part and includes first and second vias penetrating through the body part and selectively connected to the first and second metal layers, respectively. The first and second metal layers contain different metals. In some examples, a first insulating film is disposed between the first metal layer and the second via to electrically insulate the second via from the first metal layer, and a second insulating film is disposed between the second metal layer and the first via to electrically insulate the first via from the second metal layer. A method for forming the electronic component includes use of first and second etchants to selectively etch the first and second metal layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.