Flexible printed circuit cable with multi-layer interconnection and method of forming the same
US9930789B2 · kind B2 · utility
4Cited by
22References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 12, 2010 |
| Grant date | Mar 27, 2018 |
| Priority date | — |
| Expiry date | Jan 25, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The steps of forming a multi-layer flexible printed circuit cable (flex circuit) with an electrical interconnection between independent conductive layers. In accordance with various embodiments, a partial aperture is formed in the flex circuit that extends through a first conductive layer and an intervening insulative layer to an underlying surface of a second conductive layer that spans the partial aperture. A solder material is reflowed within the partial aperture to electrically interconnect the first and second conductive layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.