Multi-layer PCB having function of dissipating heat from power semiconductor module package and PCB, and production method thereof
US9930815B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 22, 2016 |
| Grant date | Mar 27, 2018 |
| Priority date | — |
| Expiry date | Nov 22, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10242
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a layered structure of a multi-layer PCB, and more particularly, to a structure of a high-power multi-layer PCB which can use a high current by efficiently dissipating heat generated from the inside of the multi-layered PCB and heat generated from a power semiconductor module package mounted on the PCB, and a production method thereof. The multi-layer PCB includes: a conductive plate having a plurality of heat poles protruding from at least one of a top surface and a bottom surface thereof; PCBs which are disposed on the top surface and the bottom surface of the conductive plate, and have a plurality of penetrating holes formed therethrough to allow the heat poles of the conductive plate to be inserted thereinto; and an insulation layer which is attached between the conductive plate and the PCBs in order to electrically insulate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.