Thermal flow meter
US9933292B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2017 |
| Grant date | Apr 3, 2018 |
| Priority date | — |
| Expiry date | Jul 18, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01F15/185
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention provides a thermal flow meter 300 which reduces a stress applied from a fixing portion 3721, which is used to hold and fix a circuit package 400 with respect to a housing 302, to the circuit package 400 and has high reliability. In the thermal flow meter of the invention, the circuit package 400 embedded with a flow rate measurement circuit is formed through a first resin molding process, the fixing portion 3721 is formed along with the housing 302 through a second resin molding process, and the circuit package 400 is enveloped by the fixing portion 3721, whereby the circuit package 400 is held by and fixed to the housing 302. In order to reduce the influence of a stress, generated based on a temperature change of the fixing portion 3721, on the circuit package 400, the fixing portion 3721 is constituted of a thick portion 4714 and a thin portion 4710. Since thickness of a resin of the thin portion 4710 is small, the stress to be generated is small, and a force applied to the circuit package 400 can be reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.