Apparatus and method for analyzing defects by using heat distribution measurement
US9933376B2 · kind B2 · utility
1Cited by
2References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 26, 2013 |
| Grant date | Apr 3, 2018 |
| Priority date | — |
| Expiry date | Jul 6, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention provides a method for analyzing defects by using heat distribution measurement, comprising: a sample loading unit for loading a sample to check whether or not there is a defect through heat distribution characteristics; a light source for radiating visible light onto the sample; a power supply unit for generating a driving signal in order to periodically heat the sample; a detection unit for detecting reflected light from the surface of the sample; and a signal generator for synchronizing the detection unit with the driving signal of the power supply unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.