Air-cavity package with dual signal-transition sides
US9935026B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 19, 2017 |
| Grant date | Apr 3, 2018 |
| Priority date | — |
| Expiry date | Jan 19, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to an air-cavity package, which includes a bottom substrate, a top substrate, a perimeter wall, a bottom electronic component, and a top electronic component. The bottom substrate includes a bottom signal via extending through the bottom substrate and the top substrate includes a top signal via extending through the top substrate. The perimeter wall extends between a periphery of the top substrate and a periphery of the bottom substrate to form a cavity. The bottom electronic component is mounted on the bottom substrate, exposed to the cavity, and electrically coupled to the bottom signal via. The top electronic component is mounted on the top substrate, exposed to the cavity, and electrically coupled to the top signal via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.