Patent · US Active

Apparatus for eutectic bonding

US9935077B2 · kind B2 · utility

0Cited by

0References

8Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Ralf Hausner · Reutlingen, DE
Andreas Duell · Stuttgart, DE
Johannes Baader · Glückstadt, DE
Rainer Straub · Entringen, DE

Key dates

Filing date	Feb 12, 2015
Grant date	Apr 3, 2018
Priority date	—
Expiry date	Jul 21, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1461
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An apparatus for eutectic bonding includes (a) a bonding frame that includes two substrates and (b) a frame device situated on the substrates, the frame device including two frames, the apparatus being usable to develop a eutectic, formed during bonding, in a spatially defined manner, whereby a volume formed by the frames and the substrates can be filled up completely with the eutectic.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.