System-in-package image sensor
US9935144B1 · kind B1 · utility
7Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2016 |
| Grant date | Apr 3, 2018 |
| Priority date | — |
| Expiry date | Nov 28, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
Abstract
An image sensor package includes a ceramic substrate with a cavity disposed in the ceramic substrate. A glass layer is adhered to the ceramic substrate and encloses the cavity in the ceramic substrate. An image sensor is disposed in the cavity between the glass layer and the ceramic substrate to electrically isolate the image sensor. An image sensor processor is disposed in the cavity and electrically coupled to the image sensor to receive image data from the image sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.