Wire-based metallization for solar cells
US9935213B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 26, 2015 |
| Grant date | Apr 3, 2018 |
| Priority date | — |
| Expiry date | Dec 22, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/547
Abstract
Approaches for fabricating wire-based metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal wires. Each metal wire of the plurality of metal wires is parallel along a first direction to form a one-dimensional layout of a metallization layer for the solar cell.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.