LED chip packaging with high performance thermal dissipation
US9935251B1 · kind B1 · utility
2Cited by
0References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2014 |
| Grant date | Apr 3, 2018 |
| Priority date | — |
| Expiry date | Mar 14, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L25/0753
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An LED package and method of manufacture. An embodiment of the LED package includes a metal base having a cavity, a flexible circuit on the base, a dielectric layer in the cavity, and an LED chip having a bottom side facing the base and electrically coupled to the flexible circuit. The LED chip is powered by current flowing through the flexible circuit, and heat generated by the LED chip is conducted to the base through the flexible circuit and the dielectric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.