MEMS component including a sound-pressure-sensitive diaphragm element and piezosensitive signal detection

US9936298B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Thomas Buck · Tamm, DE
• Fabian Purkl · Gerlingen, DE
• Michael Stumber · Ditzingen, DE
• Ricardo Ehrenpfordt · Gerlingen, DE
• Rolf Scheben · Stuttgart, DE
• Benedikt Stein · Stuttgart, DE
• Christoph Schelling · Stuttgart, DE

Key dates

• Filing date: Jul 15, 2016
• Grant date: Apr 3, 2018
• Expiry date: Jul 15, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H04R2201/003
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

For a MEMS component, in the layer structure of which at least one sound-pressure-sensitive diaphragm element is formed, which spans an opening or cavity in the layer structure and the deflections of which are detected with the aid of at least one piezosensitive circuit element in the attachment area of the diaphragm element, design measures are provided, by which the stress distribution over the diaphragm surface may be influenced intentionally in the event of deflection of the diaphragm element. In particular, measures are provided, by which the mechanical stresses are intentionally introduced into predefined areas of the diaphragm element, to thus amplify the measuring signal. For this purpose, the diaphragm element includes at least one designated bending area, which is defined by the structuring of the diaphragm element and is more strongly deformed in the event of sound action than the adjoining diaphragm sections.