Encapsulated filtered feedthrough for implantable medical devices
US9937354B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2016 |
| Grant date | Apr 10, 2018 |
| Priority date | — |
| Expiry date | Mar 24, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10303
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.