Laser processing machine
US9937590B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2011 |
| Grant date | Apr 10, 2018 |
| Priority date | — |
| Expiry date | May 10, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49778
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Laser processing machines, such as laser cutting machine (LM), including a work table receiving workpiece (W), and work arm (1) with a laser cutting head (2). Laser cutting head (2) includes nozzle receiving device (7) and nozzle (D). Via nozzle (D) laser beam (11) may be directed onto work piece (W). Machine (LM) includes main drives moving work arm (1) and/or the laser cutting head (2) on X-Y-Z axes to process work piece (W), as well as an alignment unit to adjust laser beam (11). An adjusting station (3) includes receiving unit (31) fixing nozzle (D) and/or the nozzle receiving device (7) during centering of nozzle (D). The alignment unit has head element (5B) in laser cutting head (2). Head element (5B) receives nozzle (D) and/or the nozzle receiving device (7) and is slidable in X-Y directions, via the main drives. Head element (5B) may be fixed in a selected position, within the laser cutting head (2), via clamping device (12) releasable during nozzle centering at adjusting station (3).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.