Peeling method and light-emitting device
US9937698B2 · kind B2 · utility
4Cited by
62References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2014 |
| Grant date | Apr 10, 2018 |
| Priority date | — |
| Expiry date | Dec 31, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1978
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The yield of a peeling process is improved. A first step of forming a peeling layer to a thickness of greater than or equal to 0.1 nm and less than 10 nm over a substrate; a second step of forming, on the peeling layer, a layer to be peeled including a first layer in contact with the peeling layer; a third step of separating parts of the peeling layer and parts of the first layer to form a peeling trigger; and a fourth step of separating the peeling layer and the layer to be peeled are performed. The use of the thin peeling layer can improve the yield of a peeling process regardless of the structure of the layer to be peeled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.