Thermal print head
US9937729B2 · kind B2 · utility
0Cited by
1References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2016 |
| Grant date | Apr 10, 2018 |
| Priority date | — |
| Expiry date | Dec 21, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/34
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A thermal print head includes a semiconductor substrate, a resistor layer and a wiring layer. The resistor layer is formed on the semiconductor substrate and has a plurality of heat generating portions arranged in the main scanning direction. The wiring layer is formed on the semiconductor substrate to be included in a conduction path for energizing the plurality of heat generating portions. The conduction path includes a path or paths provided by the semiconductor substrate itself.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.