Methods for improving adhesion on dielectric substrates
US9940950B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 3, 2016 |
| Grant date | Apr 10, 2018 |
| Priority date | — |
| Expiry date | May 3, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/3163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Various embodiments described herein provide for substrate structures including uniform plating seed layers, and that provide favorable adhesion on dielectric substrate layers. According to some embodiments, a methods for forming a magnetic recording pole is provided comprising: forming an insulator layer; forming a trench in the insulator layer; forming an amorphous seed layer over the insulator layer; forming an adhesion layer over the amorphous seed layer, the adhesion layer comprising a physical vapor deposited (PVD) noble metal; forming a plating seed layer over the adhesion layer, the plating seed layer comprising chemical vapor deposited (CVD) Ru; and forming a magnetic material layer over the plating seed layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.