Assembly of an integrated circuit chip and of a plate
US9941188B2 · kind B2 · utility
0Cited by
5References
21Claims
0Family size
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Inventors
Key dates
| Filing date | Jan 24, 2017 |
| Grant date | Apr 10, 2018 |
| Priority date | — |
| Expiry date | Jan 24, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/37002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An assembly includes an integrated circuit chip and a plate with at least one heat removal channel arranged between the chip and the plate. Metal sidewalls are formed to extend from one surface of the chip to an opposite surface of the plate. The assembly is encapsulated in a body that includes an opening extending to reach the channel. The plate may be one of an interposer, an integrated circuit chip, a support of surface-mount type, or a metal plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.