Patent · US Active

Strip-shaped substrate for producing chip carriers, electronic module with a chip carrier of this type, electronic device with a module of this type, and method for producing a substrate

US9941197B2 · kind B2 · utility

0Cited by

7References

13Claims

0Family size

Assignee

HERAEUS DEUTSCHLAND GMBH & CO. KG · DE

Inventors

Eckhard Ditzel · Gelnhausen, DE
Siegfried Walter · Leonberg, DE
Michael Benedikt · Chicago, US
Udo Becker · Heiligkreuzsteinach, DE

Key dates

Filing date	Jun 15, 2015
Grant date	Apr 10, 2018
Priority date	—
Expiry date	Jun 15, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/18301
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A strip-shaped substrate made from a film includes a plurality of units for producing chip carriers. Each unit has a chip island for fixing a semiconductor chip, electrodes for electrical connection of the semiconductor chip, and through-openings for structuring the unit. At least one through-opening forms an anchoring edge for a casting compound for encapsulating the semiconductor chip. A surface section of the film abutting the through-opening is chamfered to form the anchoring edge. The anchoring edge protrudes past the side of the film on which the chip island is arranged.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.