Integrated circuit with sensor and method of manufacturing such an integrated circuit
US9941222B2 · kind B2 · utility
2Cited by
7References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2016 |
| Grant date | Apr 10, 2018 |
| Priority date | — |
| Expiry date | Mar 14, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is an integrated circuit comprising a substrate carrying a plurality of circuit elements; a metallization stack interconnecting said circuit elements, said metallization stack comprising a patterned upper metallization layer comprising a first metal portion; a passivation stack covering the metallization stack; and a sensor including a sensing material on the passivation stack, said sensor being coupled to the first metal portion by a via extending through the passivation stack. A method of manufacturing such an IC is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.