Impedance matching configuration
US9941227B2 · kind B2 · utility
2Cited by
1References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 26, 2016 |
| Grant date | Apr 10, 2018 |
| Priority date | — |
| Expiry date | May 26, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03F2200/451
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package is provided. The package comprises a die and an impedance matching network. The die has a first terminal and a second terminal. The impedance matching network is coupled to the second terminal and comprises a first inductor and a first capacitor. The first inductor comprises first bond wire connections coupled between the second terminal and a first bond pad on the die, and second bond wire connections coupled between the first bond pad and a second bond pad coupled to the first capacitor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.