Light emitting device and method of manufacturing light emitting module
US9941451B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 28, 2016 |
| Grant date | Apr 10, 2018 |
| Priority date | — |
| Expiry date | Oct 28, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8582
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A light emitting device includes a wiring board, a light emitting element, and a protection film. The wiring board includes a base member, and positive and negative wiring layer parts. The positive and negative wiring layer parts are arranged on or above the upper surface of the base member. The light emitting element is mounted on the wiring layer parts in a flip-chip manner. The protection film covers the base member, the wiring layer parts and the light emitting element, and is formed of an inorganic material for serving as the exterior surface of the light emitting device. Each of the wiring layer parts has a curved outer-side edge. The curvature of the outer-side edge is substantially constant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.