Scalable thermal solution for high frequency panel array applications or other applications
US9942975B2 · kind B2 · utility
4Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2015 |
| Grant date | Apr 10, 2018 |
| Priority date | — |
| Expiry date | Jan 22, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10242
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus includes a printed circuit board (PCB) including a surface that has a layer of circuitry. The apparatus also includes a heat sink configured to receive heat from the PCB. The apparatus further includes a thermally-conductive post configured to remove the heat from the PCB to the heat sink via thermal conduction through a thermal path. The thermal path is substantially orthogonal to the surface of the PCB. The post includes an end configured to physically couple to the layer of circuitry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.