Preparation method of a boss-type metal-based sandwich rigid-flex circuit board
US9942976B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 25, 2014 |
| Grant date | Apr 10, 2018 |
| Priority date | — |
| Expiry date | Nov 25, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09054
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A boss-type metal-based sandwich rigid-flex board and preparation method thereof are disclosed. The boss-type metal-based sandwich rigid-flex board comprises a rigid sub-plate, a flexible sub-plate, a dielectric layer, and a metal core layer, wherein the metal core layer has front and back sides on which at least one metal boss and at least one heat dissipation area are arranged respectively, the dielectric layer, and the rigid sub-plate and/or the flexible sub-plate are sequentially stacked on the front and back sides of the metal core layer respectively, and each of the rigid sub-plate, the flexible sub-plate and the dielectric layer is provided with a first window area fit with the metal boss, and a second window area corresponding to the heat dissipation area. The boss-type metal-based sandwich rigid-flex board (with a metal boss and a heat dissipation area arranged on the front side) prepared according to the present disclosure uses a metal core layer for heat dissipation. In this way, not only the need of heat dissipation of the locally heating electronic components (through the metal boss) but also the heat dissipation of the high density wirings at work can be satisfied (th…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.