System with field-assisted conductive adhesive bonds
US9942986B1 · kind B1 · utility
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5References
21Claims
0Family size
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Key dates
| Filing date | Jan 6, 2017 |
| Grant date | Apr 10, 2018 |
| Priority date | — |
| Expiry date | Jan 6, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/105
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Components may have substrates with metal traces that form mating contacts. The components may be bonded together using anisotropic conductive adhesive bonding techniques. During bonding, conductive particles may be concentrated over the contacts by application of magnetic or electric fields or by using a template transfer process. Gaps between the contacts may be at least partially free of conductive particles to help isolate adjacent contacts. Polymer between the substrates may attach the substrates together. The conductive particles may be embedded in the polymer and crushed or melted to short opposing contacts together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.