High porosity acoustic backing with high thermal conductivity for ultrasound transducer array
US9943287B2 · kind B2 · utility
4Cited by
16References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2012 |
| Grant date | Apr 17, 2018 |
| Priority date | — |
| Expiry date | Jul 8, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG10K11/002
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A backing block for an ultrasonic transducer array stack of an ultrasound probe is formed as a composite structure of graphite foam impregnated with an epoxy resin. The epoxy resin penetrates the porous foam structure at least part-way into the depth of the graphite foam block and, when cured, provides the backing block with good structural stability. The composite graphite foam backing block is bonded to the integrated circuit of a transducer to provide high thermal conductivity away from the transducer and good acoustic attenuation or scattering of rearward acoustic reverberations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.