High performance transient uniform cooling solution for thermal compression bonding process

US9943931B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Zhihua Li · Changsha, CN
• Hemanth K. Dhavaleswarapu · Chandler, US
• Joseph B. Petrini · Gilbert, US
• Shankar Devasenathipathy · Tempe, US
• Steven B. Roach · Gilbert, US
• Ioan Sauciuc · Phoenix, US
• Pranav Desai · San Diego, US
• George Kostiew · Chandler, US
• Sanjoy Saha · Sherghati, IN

Key dates

• Filing date: Jul 27, 2016
• Grant date: Apr 17, 2018
• Expiry date: Jul 27, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/83203
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block.