Overmolded dual in-line memory module cooling structure
US9943936B2 · kind B2 · utility
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18References
12Claims
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Key dates
| Filing date | Oct 21, 2014 |
| Grant date | Apr 17, 2018 |
| Priority date | — |
| Expiry date | Oct 21, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53113
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods, apparatuses, and computer program products for forming an overmolded dual in-line memory module (DIMM) cooling structure are provided. Embodiments include identifying, by a tagging module, contextual information indicating circumstances in which the photograph was taken; based on the contextual information, selecting, by the tagging module, candidate profiles from a plurality of friend profiles associated with a profile of a user; and suggesting, by the tagging module to the user, the selected candidate profiles as potential friends to tag in the photograph.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.