Laser-bonded component and production method for same
US9944048B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2012 |
| Grant date | Apr 17, 2018 |
| Priority date | — |
| Expiry date | Feb 14, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12493
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Provided are a laser-bonded component and a production method for same that ensure sufficient bonding strength using little laser energy and which cause little increase in surrounding temperature. A nickel layer, being a surface layer, is formed having sufficient thickness on the upper surface of a copper plate that is uppermost amongst at least two superposed copper plates, a laser is irradiated from above the nickel layer, a re-solidification section formed by fusing and alloying the copper in the copper plates and the nickel in the nickel layer is formed through to inside the bottommost copper plate, and the copper plates are bonded together. The re-solidification section having high breaking strength is formed by the alloying of the nickel and the copper. As a result, the copper plates can be bonded with a small welding surface area and little laser energy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.