Micro-electro-mechanical device having low thermal expansion difference
US9944513B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2013 |
| Grant date | Apr 17, 2018 |
| Priority date | — |
| Expiry date | Oct 9, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B3/0081
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The invention provides a micro-electro-mechanical device which is manufactured by a CMOS manufacturing process. The micro-electro-mechanical device includes a stationary unit, a movable unit, and a connecting member. The stationary unit includes a first capacitive sensing region and a fixed structure region. The movable unit includes a second capacitive sensing region and a proof mass, wherein the first capacitive sensing region and the second capacitive sensing region form a capacitor, and the proof mass region consists of a single material. The connecting member is for connecting the movable unit in a way to allow a relative movement of the movable unit with respect to the stationary unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.