Chip electronic component and manufacturing method thereof
US9945042B2 · kind B2 · utility
15Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2014 |
| Grant date | Apr 17, 2018 |
| Priority date | — |
| Expiry date | Sep 12, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F41/046
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
There are provided a chip electronic component and a manufacturing method thereof, and more particularly, a chip electronic component having an internal coil structure capable of preventing the occurrence of short-circuits between coil portions and having a high aspect ratio (AR) by increasing a thickness of a coil as compared to a width of the coil, and a manufacturing method thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.