Patent · US Active

Wafer assembly including a guide pin wafer

US9946028B2 · kind B2 · utility

10Cited by

0References

21Claims

0Family size

Assignee

FINISAR CORPORATION · US

Inventors

Jiashu Chen · Shanghai, CN
Steve Macica · Truckee, US
Idan Mizrahi · Toronto, CA

Key dates

Filing date	Dec 16, 2016
Grant date	Apr 17, 2018
Priority date	—
Expiry date	Dec 16, 2036

Classification

Technology area (CPC G)Physics
CPC primaryG02B6/43
WIPO fieldOptics
WIPO sectorInstruments

Abstract

A guide pin wafer may include a base wafer that includes multiple dies. Each die may include a corresponding lens cutout. The guide pin wafer may also include multiple guide pins mounted on the base wafer. Each die of the base wafer may be mounted with two or more corresponding guide pins that may be configured to engage a parallel fiber connector to the corresponding die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.