Electronic/photonic chip integration and bonding
US9946042B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2015 |
| Grant date | Apr 17, 2018 |
| Priority date | — |
| Expiry date | Jun 26, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4279
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical waveguide device comprising: one or more photonic chips, the one or more photonic chips including: a first portion of a photonic chip comprising an array of first components, each of the first components having an optical input and an electrical output; and a second portion of a photonic chip comprising an array of second components, each of the second components configured to receive an electrical input; the optical waveguide device further comprising: an integrated circuit; the integrated circuit forming an electrical bridge between the electrical outputs of the first components and respective electrical inputs of the second components; wherein the integrated circuit is directly mounted onto the one or more photonic chips; and/or wherein the integrated circuit is located between the first portion of a photonic chip and the second portion of a photonic chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.