Gaskets for thermal ducting around heat pipes
US9946316B2 · kind B2 · utility
1Cited by
15References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2016 |
| Grant date | Apr 17, 2018 |
| Priority date | — |
| Expiry date | Aug 19, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The disclosed embodiments provide a component for a portable electronic device. The component includes a gasket containing a rigid portion disposed around a bottom of a heat pipe, wherein the rigid portion forms a duct between a fan and an exhaust vent of the electronic device. The gasket also includes a first flexible portion bonded to the rigid portion, wherein the first flexible portion comprises a flap that is open during assembly of the heat pipe in the electronic device and closed over the heat pipe and the rigid portion to seal the duct around the heat pipe after the assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.