Patent · US Active

Method of manufacturing thin-film polymer multi-layer capacitor and thin-film polymer multi-layer capacitor

US9947477B2 · kind B2 · utility

0Cited by
1References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 10, 2014
Grant dateApr 17, 2018
Priority date
Expiry dateMay 16, 2034

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01G13/00
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

In a method of manufacturing a thin-film polymer multi-layer capacitor, in a vacuum chamber, a resin thin film layer forming step of forming a resin thin film layer by forming a monomer layer by vapor-depositing a monomer and thereafter by curing the monomer layer by irradiating an electron beam onto the monomer layer, and a metal thin film layer forming step of forming a metal thin film layer by vapor-depositing a metal material are alternately performed on a rotary drum thus forming a multi-layer body in which the resin thin film layer and the metal thin film layer are alternately laminated on the rotary drum. In the resin thin film layer forming step, the monomer layer is formed using a dimethacrylate compound having an alicyclic hydrocarbon skeleton expressed by a following chemical formula (1) as the monomer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.