Semiconductor device with surface integrated focusing element and method of producing a semiconductor device with focusing element

US9947711B2 · kind B2 · utility

Assignee

• AMS AG · AT

Inventors

• Rainer Minixhofer · Kufstein, AT
• Martin Schrems · Langenbruck, DE
• Sara Carniello · Graz, AT

Key dates

• Filing date: Feb 10, 2015
• Grant date: Apr 17, 2018
• Expiry date: Feb 10, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10F39/182

Abstract

The semiconductor device comprises a semiconductor substrate (1), a sensor or sensor array (2) arranged at a main surface (10) of the substrate, an integrated circuit (3) arranged at or above the main surface, and a focusing element (17) comprising recesses (4) formed within a further main surface (11) of the substrate opposite the main surface. The focusing element may be arranged opposite the sensor or sensor array (2), which may be a photosensor or photodetector or an array of photosensors or photodetectors, for instance. The focusing element (17) is formed by etching the recesses (4) into the semiconductor material.