LED assembly

US9947839B2 · kind B2 · utility

Assignees

• Huga Optotech Inc. · TW
• Interlight Optotech Corporation · TW

Inventors

• Tzer-Perng Chen · Hsinchu, TW
• Tzu-Chi Cheng · Yangmei District, TW

Key dates

• Filing date: Oct 19, 2016
• Grant date: Apr 17, 2018
• Expiry date: Oct 19, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181

Abstract

This disclosure discloses an LED assembly. The LED assembly includes a transparent mount with a top surface and a bottom surface opposite to the top surface, an LED chip arranged on the top surface, an electrode plate, a first phosphor layer having a first phosphor, and a second phosphor layer having a second phosphor, wherein the transparent mount and the electrode plate substantially have a same width. The electrode plate is arranged on an edge of the top surface and electrically connected to the LED chip.