Interposer frame with polymer matrix and methods of fabrication
US9949373B2 · kind B2 · utility
7Cited by
0References
4Claims
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Key dates
| Filing date | Jan 18, 2017 |
| Grant date | Apr 17, 2018 |
| Priority date | — |
| Expiry date | Jan 18, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10242
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An array of chip sockets defined by an organic matrix framework surrounding sockets through the organic matrix framework and further comprising a grid of metal vias through the organic matrix framework. In an embodiment, a panel includes an array of chip sockets, each surrounded and defined by an organic matrix framework including a grid of copper vias through the organic matrix framework. The panel includes at least a first region with sockets having a set of dimensions for receiving one type of chip and a second region with sockets and another set of dimensions for receiving a second type of chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.