Liquid loop cooling apparatus, electronic instrument, and method for manufacturing liquid loop cooling apparatus
US9949402B2 · kind B2 · utility
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1References
16Claims
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Key dates
| Filing date | Sep 19, 2016 |
| Grant date | Apr 17, 2018 |
| Priority date | — |
| Expiry date | Oct 21, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20809
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A liquid loop cooling apparatus includes: an evaporator thermally coupled to a heating element; a condenser configured to be cooled by an airflow; a pump configured to circulate a refrigerant between the evaporator and the condenser; a first piping configured to couple the evaporator and the condenser; a second piping configured to couple the condenser and the pump; and a third piping configured to couple the pump and the evaporator, wherein the first piping is arranged on a destination side of the airflow, and the second piping is arranged on a source side of the airflow.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.