Method of manufacturing an implantable electrode array by forming packages around the array control modules after the control modules are bonded to substrates
US9950154B2 · kind B2 · utility
1Cited by
4References
11Claims
0Family size
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Key dates
| Filing date | Sep 22, 2017 |
| Grant date | Apr 24, 2018 |
| Priority date | — |
| Expiry date | Sep 22, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/185
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A method of forming an implantable electrode array that includes one or more packaged control modules. A control module is packaged by mounting the module to a substrate and forming a containment ring around the module. A conformal coating is disposed over the surface of the module to cover the carrier. Within the containment ring, the conformal coating hardens to form a non-porous shell around the control module. The one or more packaged control modules are placed in a flexible array. Electrodes that are mounted to or embedded in the flexible carrier are connected to the one or more control modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.