Insulation enclosure with a thermal mass
US9950361B2 · kind B2 · utility
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5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2014 |
| Grant date | Apr 24, 2018 |
| Priority date | — |
| Expiry date | Mar 19, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22C1/1073
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An example insulation enclosure includes a support structure having a top end, a bottom end, and an opening defined at the bottom end for receiving a mold within an interior of the support structure, and a thermal mass arranged at the top end of the support structure to thermally communicate with a top of the mold and resist heat flow from the top of the mold in an axial direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.