Hard material layer for reducing heat input into a coated substrate
US9950406B2 · kind B2 · utility
1Cited by
3References
22Claims
0Family size
Assignee
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Key dates
| Filing date | Nov 24, 2014 |
| Grant date | Apr 24, 2018 |
| Priority date | — |
| Expiry date | Apr 20, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C28/44
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A coated product having coating that includes a layer of hard material having a defined multi-ply layer structure, thereby significantly minimizing or preventing heat input into the coated substrate resulting from the effect of thermal hot spots.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.