Production of thin silicone films
US9950453B2 · kind B2 · utility
1Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2017 |
| Grant date | Apr 24, 2018 |
| Priority date | — |
| Expiry date | Feb 23, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2383/04
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Thin silicon films of high thickness uniformity and thicknesses of from 0.1 μm to 200 μm are prepared by applying a crosslinkable silicone composition to a moving carrier by means of a slot die, removing solvent, if present, and subsequently crosslinking the silicone layer formed on the carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.