Element substrate for liquid ejecting head and wafer
US9950525B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2016 |
| Grant date | Apr 24, 2018 |
| Priority date | — |
| Expiry date | Oct 19, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2002/14217
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
An element substrate for a liquid ejecting head includes a substrate, an element forming layer on the substrate, and a discharge port forming member formed of an insulating member on the element forming layer. The element forming layer includes an energy generating element configured to provide energy to a liquid for ejection. The discharge port forming member includes a discharge port forming surface having discharge ports through which the liquid is ejected and an exterior side surface positioned between the discharge port forming surface and the element forming layer. The exterior side surface has a first edge facing the element forming layer. The element substrate further includes a conductive layer disposed between the first edge and the element forming layer and grounded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.