Polyamide resin composition and molded article
US9951202B2 · kind B2 · utility
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Key dates
| Filing date | Oct 14, 2015 |
| Grant date | Apr 24, 2018 |
| Priority date | — |
| Expiry date | Oct 14, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2003/2296
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyamide resin composition including a polyamide resin (A), a copper compound (B), a bromide of an alkali metal and/or a bromide of an alkaline earth metal (C), and at least one fatty acid compound (D) selected from the group consisting of fatty acid esters, fatty acid amides, and fatty acid metal salts, wherein the fatty acid compound (D) has an acid value of 5 mgKOH/g or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.