High efficiency thermal transfer plate
US9952004B2 · kind B2 · utility
1Cited by
6References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 4, 2014 |
| Grant date | Apr 24, 2018 |
| Priority date | — |
| Expiry date | Dec 6, 2035 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F21/065
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The present invention provides a high efficiency thermal transfer plate for providing thermal transfer to and from a fluid. More specifically the present invention provides a thermal transfer plate including a skived fin plate for improved thermal transfer between a fluid within the thermal transfer plate and the thermal transfer plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.