Gas sensor package
US9952171B2 · kind B2 · utility
4Cited by
13References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 2, 2015 |
| Grant date | Apr 24, 2018 |
| Priority date | — |
| Expiry date | Nov 8, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A gas sensor package comprises a gas sensor chip with a layer sensitive to a gas, and with a heater for heating the sensitive layer. Contact pads are provided for electrically contacting the gas sensor package and a die pad is provided for mounting the gas sensor chip to. Electrical connections connect the gas sensor chip and the contact pads. A molding compound at least partially encloses the gas sensor chip. An opening in the molding compound provides access to the sensitive layer of the gas sensor chip. One of the contact pads serves as a pin for supplying electrical current to the heater of the gas sensor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.