Methods and systems for forming electronic modules
US9953845B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2011 |
| Grant date | Apr 24, 2018 |
| Priority date | — |
| Expiry date | May 7, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing an electronic module includes providing a conductive strip and a dielectric material. The method includes coating the dielectric material and the conductive strip to form a layered structure having a conductive layer defined by the conductive strip and a dielectric layer defined by the dielectric material. The method includes applying a carrier strip to the layered structure. The method includes processing the conductive layer to form a circuit while the layered structure is on the carrier strip. The method includes removing the carrier strip from the layered structure. The method includes applying the layered structure with the circuit to an electronic module substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.